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Ventev Announces Partnership with the Venti Group to Create Next-Generation DAS Antenna and RF Technologies

HUNT VALLEY, Md.--(BUSINESS WIRE)--Dec. 30, 2014-- Ventev Wireless Infrastructure, a unit of TESSCO Technologies Incorporated (NASDAQ: TESS), and the Venti Group, LLC today announced plans to collaborate and introduce high-performance antennas and RF technologies that will meet carrier and enterprise demand for increased indoor 3G and LTE network coverage and capacity today, and in the future.

With the ever-increasing use of smartphones, tablets and other mobile devices, network operators in colleges, stadiums, corporate office buildings and city centers are tasked with providing next-generation cellular coverage and capacity both indoors and outdoors, as well as minimizing the contribution to noise levels introduced into the system as bandwidth needs increase. The RF technologies for distributed antenna systems (DAS) developed by Venti and incorporated into Ventev’s TerraWave® antennas will solve these challenges.

Ventev®, a market leader in engineering-driven wireless products that support wireless radio deployments in enterprise environments, chose the Venti Group as a technology partner because of the company’s proficiency in low-PIM technologies, as well as its patented Horizontal Polarization RF technologies. Ventev will market, sell, and distribute these innovative products through TESSCO Technologies.

“We are very enthusiastic about the partnership with the Venti Group and the antenna products we are creating that incorporate Venti technologies to solve complicated RF challenges,” said Jeff Lime, Vice President of Ventev Wireless Infrastructure. “We look forward to sharing these exciting innovations with our customers in the near future.”

“Venti Group chose to partner with Ventev and TESSCO to exclusively bring to the North American market our DAS technology because of their leading wireless position in North America,” said Hank Adamany, Managing Director of Venti Group. “Our partnership enables Ventev to expand the use of Venti technology in additional products in the future. The Venti Group is dedicated to changing the Wireless World though its innovative breakthrough technologies.”

For more information about Ventev’s complete ecosystem of antennas, enclosures, and accessories that optimize and enhance any type of wireless network, please visit www.ventev.com/infra.

About Ventev Wireless Infrastructure

Ventev Wireless Infrastructure, a unit of TESSCO Technologies Inc., designs and manufactures solutions that deploy, protect, power, and improve the performance of indoor and outdoor Wi-Fi, DAS (distributed antenna systems), cellular, mesh and two-way networks. Ventev Wireless Infrastructure's (www.ventev.com/infra) three product lines are: TerraWave Solutions® (Wi-Fi enclosures, antennas and cable assemblies); Ventev® (integrated power and outdoor enclosure solutions); and Wireless Solutions® (base station infrastructure including towers, site hardware and grounding).

About TESSCO

TESSCO (NASDAQ: TESS) makes wireless work. The convergence of wireless and the Internet is creating opportunities for new applications that revolutionize the way we live, work and play. TESSCO Technologies enables organizations to capitalize on these opportunities while providing an extraordinary business experience. We deliver the knowledge, product and supply-chain solutions required to build, use, and resell wireless voice, data and video systems.

About Venti Group, LLC

The Venti Group develops wireless technologies that improve connectivity and data throughput for today’s wireless world. Venti IP is comprised of three global patent families. The Venti™ antenna technology, a patented omni directional, horizontally polarized compact and low cost antenna technology; when paired with a vertically polarized antenna delivers true polarization diversity for greater coverage and data throughput. The Venti™ antenna technology also includes compact single feed circular polarization. The Venti™ sleeve is a passive RF suppression sleeve that helps to mitigate unwanted EMI / RFI / PIM or spurious noise traveling over the outer jacket of coax & cable. And the most recent member of the Venti IP family is the newly introduced Venti™ PIMconnect – manufacturing techniques used to produce Low PIM rated antennas. The Venti Group is committed to bringing our technologies to the Wireless World to enhance all communications with greater coverage along with faster and more reliable data.

Source: TESSCO Technologies Incorporated

TK\PR Public Relations, Inc.
Mary Lou DiNardo, 212-909-0340
mldinardo@tkprpublic.com