HUNT VALLEY, Md.--(BUSINESS WIRE)--May 19, 2014--
Wireless Infrastructure, a division of TESSCO
Technologies Incorporated (NASDAQ:TESS), will showcase solutions
from its comprehensive product portfolio, including the new TerraWave
Wireless LAN Site Survey Kit, at Cisco Live 2014, May 18-22, in San
Francisco. Hosted by Cisco
Systems, the conference is the industry’s premier education and
training event focused on the innovations of tomorrow – with topics that
span technical education, IT management, and service provider programs.
For more than 12 years TerraWave, one of Ventev Wireless
Infrastructure’s three product lines and a Cisco Solution Developer, has
been designing market-leading antenna, cabling, and enclosure solutions
that simplify the process of deploying, maintaining and securing Cisco
Wi-Fi networks in any environment.
Products on display at the show will include:
New! TerraWave Cisco Indoor AP Wireless LAN Site Survey Kit (TESSCO
No. 502643) –enables precise site surveys that eliminate deployment
issues and allow for seamless network implementation of Cisco indoor
access points. Easy to transport, organize, and inventory, the kit
equips system engineers with all of the critical products needed to
perform professional site surveys in most environments and industries.
New! TerraWave High-Density Patch Antenna for Cisco and Meraki
Access Points (TESSCO No. 515086) – features a narrow beamwidth
and advanced technology that reduces the number of users per access
point, increasing the capacity for improved coverage in high-density
Ventev PoE Outdoor Enclosure System for the Cisco 3602e Access
Point (TESSCO No. 566513) – allows indoor access points to be
deployed in outdoor environments. For refrigerator-type applications,
Ventev also offers a Freezer Enclosure System (TESSCO No. 501516).
TerraWave Co-Locating Mount (TESSCO No. 568600) – simplifies
overall deployments of high-density networks by co-locating the
antenna with the access point, and features an aesthetically pleasing
design that conceals the access point and cabling.
for more information on the Cisco-compatible solutions that Ventev
Wireless Infrastructure will have on display at the Moscone Center, May
18-22, in San Francisco.
About Ventev Wireless Infrastructure
Wireless Infrastructure, a division of TESSCO Technologies Inc.,
designs and manufactures solutions that deploy, protect, power, and
improve the performance of every type of wireless network: Wi-Fi, DAS
(distributed antenna systems), cellular, mesh and two-way. Ventev’s
extensive line of products such as antennas, enclosures, cable, and
solar-powered base stations support these networks and their
applications both indoors and outdoors. Ventev Wireless Infrastructure's
three product lines are: TerraWave Solutions® (Wi-Fi
enclosures, antennas and cable assemblies); Ventev®
(integrated power and outdoor enclosure solutions); and Wireless
Solutions® (base station infrastructure including towers,
site hardware and grounding).
Technologies Inc. (NASDAQ:TESS), Hunt Valley, Maryland, is Your
Total Source® for making wireless work. The convergence
of wireless and the Internet is revolutionizing the way we live, work
and play. New systems and applications are creating opportunities and
challenges at an unprecedented rate. TESSCO is there, thinking in new
ways for exceptional outcomes. TESSCO (www.tessco.com)
architects and delivers, with innovation, productivity and speed, the
product and value chain solutions to organizations responsible for
building, using and maintaining wireless broadband systems. The Company
is a component of the Russell 2000® index.
Source: TESSCO Technologies Inc.
TK\PR Public Relations, Inc.
Mary Lou DiNardo, 212-909-0340